Friday, 22 January 2010
French focus on 3D packaging for consumer and wireless applications
Posted on 12:56 by Unknown
Leti and R3Logic to Combine Expertise in Three-Year Lab Agreement
French research lab Leti is teaming up with R3Logic, a leading US 3D IC EDA company to combine their expertise in 3D silicon integration and packaging in France to build 3D IC designs and methodologies for consumer and wireless
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