Thursday, 3 November 2011
VIA Brings Fanless Dual Core Computing and USB 3.0 to Thin Embedded Devices
Posted on 13:23 by Unknown
New slimline Em-ITX form factor boardBy Nick Flaherty www.flaherty.co.ukVIA Technologies has launched its latest Em-ITX form factor board, the VIA EITX-3002, which combines rich I/O with multimedia. Partnered with the new VIA AMOS-5002 industrial chassis kit, the VIA EITX-3002 provides a wide range of durable and fanless next generation devices in medical, healthcare, industrial and building
Subscribe to:
Post Comments (Atom)
0 comments:
Post a Comment