Maximizes efficiency advantages of MOSFETs and is standardised with Infineon
It's not often you can get excited about power packaging, but the latest development by STMicroelectronics has increased the power density achievable, and so reduced the size of equipment, with a key new surface mount package for its latest generation MDmesh V power MOSFET technology.
The new 1mm-high surface-mount
Wednesday, 5 May 2010
STMicro and Infineon launch breakthrough power package
Posted on 07:01 by Unknown
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