Adds Land Grid Array (LGA) packaging option and ARM9 processor
Cinterion Wireless Modules has launched a new machine-to-machine wireless data module for automotive designs. The new AGS3 module adds land grid array (LGA) technology to its automotive-grade modules. The AGS3 is Cinterion’s sixth-generation automotive module and is optimised for peak performance and rugged automotive application
Monday, 19 April 2010
Cinterion Adds Wireless M2M Module for Automotive
Posted on 00:24 by Unknown
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