Compatibility Agreement for Power MOSFET pinout
Infineon Technologies and Fairchild Semiconductor have signed a packaging partnership for their power MOSFETs in the Infineon PowerStage 3x3 or Fairchild MLP 3x3 (Power33) packages.
The compatibility agreement is in response to the need for supply security while balancing the drive towards best-in-class efficiency and thermal performance in
Thursday, 22 April 2010
Infineon and Fairchild standardise power MOSFETs packaging
Posted on 03:06 by Unknown
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